Cyclone dust cleaning in the FBGA precision pitch ball grid array chip packaging process FBGA (CSP), FCBGA, BOC, COF substrate, packaging, and cleaning before inspection

BGA packaging is a method in which the pins at the bottom of the chip are replaced by solder balls. Hundreds of tiny solder balls are fixed by flux positioning and then fixed to the PCB using surface mount soldering technology. The arrangement of the bottom solder balls should also correspond to the corresponding position of the substrate. With different packaging requirements for chip upgrades and performance, the cleanliness requirements for substrates and solder joints are also increasing.

Cyclone cleaning is currently used in the following chip packaging fields, and can be expanded according to user needs:

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  Cleaning process during CPU Board manufacturing

  
  

  BOC package cleaning of DRAM device chips

  
  

  -Cleaning before installation of FCBGA flip chip ball grid array and graphics acceleration chip

  
  

  Cleaning of FBGA Board substrate, printing, coating, adhesive, AOI testing and other manufacturing processes

  
  

1. Clean the top and bottom of FBGA Board before AVI & AOI

2. Silk&PSR cleaning before printing and adhering foreign matter before printing                                                                                                                                                            

3. Cu Foil Lamination貼合前附著異物清潔   

4. Exposure D/F Laminating Cleaning of foreign matter attached before bonding

5.Dump project: cleaning of foreign matter attached to PAD & Via Hole; removal of foreign matter attached to many VIA Holes in the mounting substrate area

6.Back Side Tape Laminating: Clean foreign matter attached before lamination.

7. CPU Manufacturing Process Tray Cleaning