Semiconductor wafer wafer process, chip packaging process - cyclone dry cleaning and dust removal - equipment unit
The manufacturing processes of various wafers are extremely sophisticated and complex, and each major factory has different process control and extreme equipment capabilities. As an auxiliary cleaning equipment unit for the front and rear main processes, the cyclone cleaning/dust removal/foreign matter removal system has been adopted by wafer fabs and equipment manufacturers due to its advantages of non-contact, efficient cleaning, and easy installation.
It is currently used in the following scenarios:
The FAB equipment has a built-in lightweight cyclone module head to assist the handling robot in cleaning the wafers.
Cyclone Cleaning of Wafer Grinding Disk Wheel
Foreign matter removal after wafer cutting
Removal of foreign matter remaining after memory chip laser marking
Removing foreign matter from trays used for chip transfer
Removal of foreign matter before and after chip placement
